3B Semiconductors Pvt Ltd - Developing Design Ideas for the Future

Chip Design

Leveraging in-house expertise and collaborating with esteemed partners and top technical institutions, we deliver world-class custom ASIC and silicon engineering services. Our design capabilities encompass a wide range of geometries, from 180nm to 10nm, and extend across critical domains such as power management, data converters, clocking systems, and signal conditioning.

Design Methodology

Advanced design methodologies incorporating low-power, high-performance, and area-efficient design techniques.

Expertise in synthesis, place and route, static timing analysis, and power analysis.

Utilization of industry-standard EDA tools

Design Verification

Comprehensive verification strategy including functional, timing, and power verification.

Expertise in static and dynamic timing analysis, power estimation, and low-power verification.

Utilization of advanced verification methodologies such as formal verification and assertion-based verification.

Physical Design

Optimized physical design for optimal performance, power, and area.

Expertise in floor-planning, placement, routing, and clock tree synthesis.

Utilization of advanced physical design techniques such as design for manufacturability (DFM) and design for test (DFT).

Analog/Mixed-Signal Design

Strong foundation in analog circuit design principles and mixed-signal design methodologies.

Expertise in high-speed ADC/DAC design, PLL design, and filter design.

Utilization of advanced simulation tools for circuit-level and system-level analysis.

Packaging and Assembly

To ensure seamless transition from design to production, we collaborate with world-class third-party fabrication facilities. Our comprehensive services encompass package design optimization, assembly process development, and rigorous quality control to deliver high-yield, reliable, and cost-effective packaged chips, meeting the most stringent industry standards

General FAQ

We specialize in delivering cutting-edge chip designs across various applications, including high-performance computing, IoT, automotive, and mobile/consumer electronics. Our focus lies in architecture definition, microarchitecture design, logic design, physical design, and verification.

We provide comprehensive prototyping services, encompassing chip fabrication through partnerships with leading foundries, package design, PCB design and fabrication, system integration, and detailed characterization and testing.

Yes, we collaborate with world-class third-party fabrication facilities for optimized package design, assembly process development, and rigorous quality control.

We incorporate DFM principles throughout the design process to ensure optimal manufacturability and yield.

Our chip design and prototyping services cater to a wide range of industries, including automotive, consumer electronics, healthcare, industrial automation, and aerospace(upcoming..).

Yes but depends, we can provide design consulting services to help clients with architecture definition, technology selection, and design optimization.

Technical FAQ

We utilize advanced design methodologies for low-power, high-performance, and area-efficient chip design. Our approach incorporates synthesis, place and route, static timing analysis, and power analysis.

Our comprehensive verification strategy includes functional, timing, and power verification. We employ static and dynamic timing analysis, power estimation, and low-power verification techniques.

We leverage industry-standard EDA tools. Specifics details sharing would need NDA. 

Our design flow encompasses architecture definition, microarchitecture design, logic design, synthesis, place and route, static timing analysis, power analysis, physical verification, and sign-off.

We utilize a combination of standard cell libraries, IP blocks, and custom libraries to optimize chip design based on specific project requirements.

Our expertise covers a range of process nodes, including 28nm, 16nm, and 7nm, allowing us to adapt to different project needs.

Business and Collaboration FAQ

While this division core expertise lies in ASIC design, we can explore FPGA-based solutions if required by the project.

We have robust IP protection measures in place, including confidentiality agreements, secure design environments, and compliance with industry standards.

Our turnaround time depends on project complexity and specific requirements. We strive to deliver projects efficiently while maintaining high quality.

We have a rigorous quality assurance process in place, including design reviews, simulations, and verification to deliver reliable and high-performing chips.

We foster close collaboration with clients throughout the project lifecycle, ensuring open communication and alignment with project goals.

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